IntroductionIntroduction
PET high-temperature tape is widely used for masking during reflow soldering, but residue-free removal requires care. Improper techniques can scratch PCBs or leave behind adhesive, affecting subsequent processes.
Step-by-Step Removal Process
Heating Preparation:
Use a heat gun (150-200°C) to soften the adhesive of PET tape and avoid high temperature damage to PCB.
Apply heat evenly for 30-60 seconds.
Gentle Peeling:
Use a plastic scraper or tweezers to peel slowly from the edge to avoid tearing.
For stubborn areas, repeat heating and peel gradually.
Residue Removal:
Apply isopropyl alcohol (IPA) to a cotton swab to clean residual glue.
Avoid acetone, which may corrode PCB coating.
PET Tape Removal Challenges
Adhesion Buildup: Prolonged exposure to high temperature can cause adhesive penetration, increasing the difficulty of removal.
Surface Sensitivity: Sensitive materials (such as ceramic substrates) require low temperature heating (<100°C).
Alternative Solutions
Cold Peeling: For uncured tape, direct peeling can reduce residue.
Solvent Soaking: Soak the parts in IPA for 10 minutes to soften the tape (for non-electronic components).
Conclusion
Proper removal of PET material high temperature tape balances speed and safety. By combining heating and gentle mechanical peeling, engineers can protect PCBs and extend device life.
