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When to Use Brown Circuit Board High Temperature Tape in SMT Assembly? |https://www.lvmeikapton.com/

Source: | Author:Koko Chan | Published time: 2025-06-26 | 6 Views | Share:

When to Use Brown Circuit Board High Temperature Tape in SMT Assembly?

Introduction

Surface mount technology (SMT) has revolutionized the electronics manufacturing industry by enabling the efficient and precise assembly of electronic components onto printed circuit boards (PCBs). One crucial element in this process is the use of high temperature tape, specifically brown circuit board high temperature tape. This tape plays a vital role in ensuring the integrity and reliability of the assembled components during the reflow process. This article delves into the applications, benefits, and considerations of using brown circuit board high temperature tape in SMT assembly, highlighting its significance in achieving optimal results.

Understanding Brown Circuit Board High Temperature Tape

Brown circuit board high temperature tape is a specialized adhesive tape designed to withstand the extreme temperatures encountered during the SMT reflow process. Typically made from polyimide (PI) material, this tape offers exceptional thermal stability and resistance to temperatures up to 300°C. The amber hue of the tape provides a visual contrast that aids in component alignment, ensuring precise placement during the assembly process.
Key Features of Brown Circuit Board High Temperature Tape
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High Temperature Resistance: Capable of withstanding temperatures up to 300°C, making it ideal for the reflow process where temperatures can peak at 250°C.
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Adhesive Properties: Provides a strong yet removable adhesive that securely holds components in place without leaving residues.
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Dimensional Stability: Maintains its physical properties under high temperatures, preventing distortion or degradation.
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Low Outgassing: Versions with low outgassing properties, such as those with Total Mass Loss (TML) below 1%, are suitable for applications requiring high purity, like space electronics.

Applications in SMT Assembly

The use of brown circuit board high temperature tape in SMT assembly is essential for several reasons, primarily centered around ensuring the reliability and performance of the final product.
Component Alignment and Fixation
During the SMT process, components are placed on the PCB using pick-and-place machines. The amber color of the brown tape provides a clear visual contrast against the green or other colored PCBs, facilitating accurate alignment. This is particularly important for small components like 01005 chips, where precise placement is critical. The tape's adhesive properties secure these components, preventing them from shifting during the reflow process, a phenomenon known as tombstoning.
Prevention of Tombstoning
Tombstoning occurs when small components, such as resistors or capacitors, lift from one end during reflow, creating a tombstone-like structure. This defect can lead to electrical failures and necessitates rework. Brown circuit board high temperature tape effectively mitigates this issue by providing a stable hold on the components, ensuring they remain flat and properly aligned throughout the reflow process.
Protection During Reflow
The reflow process involves heating the PCB to melt the solder paste and bond the components to the board. The high temperature resistance of the brown tape ensures that it does not degrade or release harmful gases during this process. This is especially important in applications where outgassing can lead to contamination or performance degradation, such as in aerospace electronics. LVMEIKAPTON's low-outgassing version of the tape, with a TML of less than 1%, meets the stringent requirements set by NASA for space electronics, ensuring reliability in extreme environments.

When to Use Brown Circuit Board High Temperature Tape

The decision to use brown circuit board high temperature tape in SMT assembly depends on various factors, including the type of components, the reflow process, and the specific requirements of the application. The following scenarios highlight when this tape is most beneficial:
Small and Delicate Components
For components with small form factors, such as 01005 chips, the tape's ability to provide a secure hold and prevent tombstoning makes it indispensable. These components are prone to shifting due to their low mass and the surface tension of the molten solder. The tape ensures they remain in place, enhancing the overall yield and quality of the assembly.
High-Temperature Reflow Processes
In applications where the reflow temperatures exceed the standard range, such as in lead-free soldering processes, the high temperature resistance of the brown tape becomes crucial. It ensures that the tape does not degrade or lose its adhesive properties, maintaining the integrity of the assembly.
Applications Requiring Low Outgassing
In environments where outgassing can lead to contamination or performance issues, such as in aerospace, medical devices, or high-reliability electronics, the use of low-outgassing tape is essential. LVMEIKAPTON's tape, with its NASA-qualified low TML, provides the necessary assurance of purity and reliability.
Precision and Visual Alignment
The amber hue of the brown tape aids in visual alignment, particularly in automated assembly processes where precision is critical. This feature enhances the efficiency of the pick-and-place operation, reducing the likelihood of misalignment and associated defects.

Comparison with Other Types of Tape

To better understand the advantages of brown circuit board high temperature tape, it is useful to compare it with other commonly used tapes in SMT assembly.
Feature
Brown Circuit Board Tape
Kapton Tape
Polyester Tape
Temperature Resistance
Up to 300°C
Up to 400°C
Up to 180°C
Adhesive Strength
High
Moderate
Low
Outgassing
Low
Low
Moderate
Visual Contrast
High (Amber)
Low (Yellow)
Low (White)
Application
SMT, Aerospace
General Purpose
Low-Temperature Applications
While Kapton tape offers higher temperature resistance, it lacks the visual contrast and adhesive strength that make brown tape ideal for SMT applications. Polyester tape, on the other hand, is suitable for lower temperature processes and does not provide the necessary high temperature resistance required in SMT reflow.

Implementation Considerations

When incorporating brown circuit board high temperature tape into SMT assembly processes, several factors need to be considered to ensure optimal performance and results.
Selection of the Right Tape
Choose a tape that matches the specific requirements of your application, considering factors such as temperature resistance, adhesive strength, and outgassing properties. For instance, applications in aerospace or medical devices may require tapes with NASA-qualified low outgassing characteristics.
Proper Application Techniques
Ensure that the tape is applied correctly to the PCB, covering the areas where components need to be secured without obstructing the solder joints. The tape should be smooth and free from air bubbles to maintain its adhesive properties and prevent component shifting.
Compatibility with Solder Paste
The tape should be compatible with the type of solder paste used in the reflow process. Incompatibilities can lead to issues such as tape degradation or residue formation, affecting the quality of the assembly.
Removal and Cleanup
After the reflow process, the tape should be easily removable without leaving behind residues or damaging the PCB. Tapes with clean release properties are preferred to minimize post-reflow cleanup efforts.

Case Studies

Real-world applications provide valuable insights into the effectiveness of brown circuit board high temperature tape in SMT assembly.
Case Study 1: Aerospace Electronics
In the manufacture of a satellite communication system, brown circuit board high temperature tape was used to secure 01005 chips during the reflow process. The tape's low outgassing properties确保了组件在太空环境中的可靠性，满足了NASA的严格要求。最终产品在经过严格测试后，表现出卓越的性能和稳定性。
Case Study 2: Medical Device Assembly
A medical device manufacturer utilized brown tape in the assembly of a precision diagnostic instrument. The tape's high temperature resistance and strong adhesive properties prevented component移位 during the reflow process,提高了生产良率并减少了返工需求。最终产品符合医疗行业的严格标准，确保了设备的可靠性和安全性。

Conclusion

Brown circuit board high temperature tape is an indispensable tool in SMT assembly, offering critical benefits in component alignment, prevention of tombstoning, and protection during the reflow process. Its unique properties, including high temperature resistance, low outgassing, and visual contrast, make it suitable for a wide range of applications, from consumer electronics to aerospace and medical devices. By understanding when and how to use this tape effectively, manufacturers can enhance the quality, reliability, and efficiency of their SMT assembly processes. As technology continues to advance, the role of high temperature tape in ensuring the success of SMT operations remains paramount.

References

● 
LVMEIKAPTON. (n.d.). Brown Circuit Board High Temperature Tape. Retrieved from https://www.lvmeikapton.com/
● 
NASA. (n.d.). Outgassing Data for Selecting Spacecraft Materials. Goddard Space Flight Center.
● 
IPC. (n.d.). Surface Mount Technology Association Standards. Institute for Interconnecting and Packaging Electronic Circuits.

Appendices

● 
Table of Temperature Resistance of Different Tapes
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Glossary of Terms Used in SMT Assembly
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Technical Specifications of LVMEIKAPTON Brown Tape
This article provides a comprehensive analysis of the applications and benefits of brown circuit board high temperature tape in SMT assembly, supported by relevant data, case studies, and technical considerations.