How High Temperature Kapton Tape Improves FPC Processing Yield in Flexible Circuit Production

Many FPC manufacturers face bubbling and residual glue issues after high-temp pressing, which scrapes flexible boards and raises production costs. Ordinary adhesive tapes fail under 230°C hot pressing and leave stubborn residue on circuit traces.

Lvzhimei’s silicone PI kapton tape features stable dimensional shrinkage and high-temperature resistance up to 260°C. We helped a Malaysia FPC factory cut defective rate by 18% after sample trial. Our film thickness ranges from 12.5μm to 50μm, customizable slitting for ultra-narrow FPC masking.

All products meet RoHS & REACH standards for electronic export.

If your FPC line is troubled by leftover glue and poor masking effect, send your process temperature to get free samples for testing.